Description
GE PACSystems RX3i IC694MDL646 – High‑density 24 VDC Discrete Output Module for Fast, Reliable Machine Control
The IC694MDL646 is a discrete output module for the PACSystems RX3i platform, designed for high‑density 24 VDC output applications. From my experience, it’s a go‑to when you need a lot of reliable points in a compact footprint—think solenoids, contactor coils, pilot lamps, small valves, and interposing relay driving on packaging lines, conveyors, and general machine control. One thing I appreciate is the clean diagnostic behavior and the straightforward wiring layout, which typically keeps commissioning time down.
Order Placement Process and Guarantees
- Warranty: 365 days
- Delivery time: 1 week if in stock; no more than one month at the latest
- Payment terms: 50% advance payment; full payment prior to delivery
- Express options: FedEx, UPS, DHL
- Packaging & testing: Each unit is function‑checked and packed for transit shock protection
Key Features
- 24 VDC positive‑logic outputs – Suitable for sourcing loads such as indicators, solenoids and interposing relays.
- High‑density channel count – Ideal where panel space is tight and wiring is standardized (commonly grouped commons to simplify harnessing).
- Per‑point status LEDs – You can see output state at a glance during I/O checkouts and troubleshooting.
- Group isolation – Outputs are typically arranged in isolated groups to help segment loads and reduce cross‑coupling noise.
- Fast switching – Short on/off delays support rapid machine sequencing and crisp motion interlocks.
- RX3i rack integration – Installs on standard RX3i baseplates, configured via PAC Machine Edition along with the rest of your PAC.
- Load protection best practices – Supports inductive loads with proper suppression; diagnostics help pinpoint wiring or load issues in many cases.
Technical Specifications
| Brand / Model | GE PACSystems RX3i / IC694MDL646 |
| HS Code (reference) | 8537.10 – Programmable controllers |
| Power Requirements | Backplane: 5 VDC (approx. 150 mA typical); Field supply: 24 VDC nominal for loads (commonly 18–30 VDC) |
| Signal I/O Type | Discrete outputs, 24 VDC, sourcing (positive logic); high‑density multi‑point |
| Output Grouping | Outputs arranged in isolated groups with separate commons to segment loads |
| Communication Interface | RX3i backplane bus; front‑panel status LEDs |
| Operating Temperature | 0 to 60 °C (32 to 140 °F) typical RX3i environmental rating |
| Installation Method | Single‑slot module; mounts to PACSystems RX3i baseplate; field wiring via detachable terminal connection |
| Dimensions & Weight | Standard RX3i single‑slot form factor; approx. 0.25–0.35 kg (typical) |
Note: The IC694MDL646 is a 24 VDC discrete output module for the RX3i family. Exact point count and per‑point load ratings vary by load type and wiring; if you’re driving inductive devices, we typically recommend external suppression and grouping by energy class.
Related or Supporting Products
- IC694MDL645 – Relay output module (use when you need dry contacts for mixed AC/DC loads).
- IC694MDL660 – 24 VDC input module, positive logic (pair on the input side for sensors and switches).
- IC695CHS012 – 12‑slot RX3i baseplate (rack for CPU, power supply, and I/O modules).
- IC695PSD040 – RX3i power supply, 40 W (typical choice for small to mid‑size racks).
- IC694TBB032 – Matching terminal block, 32‑point screw type (helps streamline wiring and maintenance).
Installation & Maintenance
- Cabinet & environment: Install in an enclosed industrial panel with adequate ventilation; 0–95% RH non‑condensing is typical.
- Wiring: Use 24 VDC class‑2/SELV supplies. Keep sensor/logic wiring separate from mains. For inductive loads, add flyback diodes or RC snubbers at the device.
- Grounding & noise: Bond panel ground properly; route high‑current load cables away from low‑level signals to reduce EMI.
- Commissioning: Verify polarity (sourcing outputs) and group commons before energizing. You might notice faster checkouts if you label groups by load type.
- Service: Periodically re‑torque terminals, clean dust with dry air, and review diagnostics. Firmware updates are generally applied to the CPU; the I/O module rarely requires updates.
- Safety: De‑energize field power before changing wiring. Hot‑swap is supported on many RX3i I/O modules, but I typically plan a controlled stop to avoid nuisance trips on shared commons.
Quality & Certifications
- Certifications: CE, UL/cUL, and RoHS compliance for typical RX3i modules
- Manufacturer Warranty: Standard manufacturer coverage; sales warranty provided for 365 days as stated above
- Traceability: Units ship with identifiable part/serial information for maintenance records
If you’re replacing an existing IC694MDL646, share your load type and point count. We can confirm per‑point current, group limits, and suggest suppression hardware so the module runs cool and stable over time.
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