ADVANCED ENERGY 3156115-704 | high-performance RF plasma generator engineered

$7,880.00

  • Product Model: ADVANCED ENERGY 3156115-704
  • Brand: Advanced Energy (AE)
  • Warranty: One Year
  • Input Voltage: 400 VAC, 3-phase, 50 / 60 Hz
  • Operating Temperature: +10 °C to +40 °C (water-cooled operation)
Categories: Tags: SKU: 3156115-704
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Description

Technical Specifications

  • Product Model: ADVANCED ENERGY 3156115-704
  • Brand: Advanced Energy (AE)
  • Warranty: One Year
  • Input Voltage: 400 VAC, 3-phase, 50 / 60 Hz
  • Operating Temperature: +10 °C to +40 °C (water-cooled operation)
  • Storage Temperature: -20 °C to +70 °C
  • Response Time: < 15 μs power regulation response
  • Protection Class: IP20 rack mount enclosure
  • Accuracy Class: ±0.5% RF output power regulation
  • Output Frequency: 13.56 MHz
  • Rated Current Range: 18 A maximum DC auxiliary draw
  • Communication Interface: RS-232, analog I/O, DeviceNet compatible
  • Supported Protocols: Serial command protocol, 0–10 V analog control
  • Overload Capacity: Integrated arc suppression; continuous 110% power for 60 seconds
  • Dimensions: 483 mm × 133 mm × 457 mm
  • IC697VDD100

Product Overview

The ADVANCED ENERGY 3156115-704 is an Apex 5513 high-performance RF plasma generator engineered for precision semiconductor and thin-film manufacturing processes. This unit delivers regulated 5500 W RF power at 13.56 MHz to sustain stable plasma within vacuum process chambers. It incorporates built-in arc management circuitry to rapidly detect and suppress plasma arcs, minimizing wafer substrate damage and improving thin-film uniformity. The generator supports closed-loop power and impedance control and offers multiple control interfaces to integrate seamlessly with wafer processing automation systems. Process and equipment engineers rely on this RF power source for consistent deposition, etching and surface treatment results. Stable RF output reduces process variation, improves production yield, and extends service intervals for vacuum manufacturing equipment.

Application Scenarios

  • Semiconductor Wafer Etching Systems: Supplies controlled RF energy for dielectric and conductor plasma etching. Fast arc response prevents micro-defects on advanced-node silicon wafers during high-volume fabrication.
  • Thin-Film Sputtering Deposition Lines: Drives planar magnetron sputtering targets for optical coating and display panel manufacturing. Continuous impedance stabilization maintains uniform film thickness across large-area substrates.
  • Solar Cell Photovoltaic Production: Used for transparent conductive layer deposition on photovoltaic wafers. Precision power regulation ensures consistent conversion efficiency across batches of solar cells.
  • Industrial Vacuum Plasma Surface Treatment: Performs plasma cleaning, activation and polymer coating for medical components and precision electronics. Flexible analog and serial control simplifies integration with automated batch vacuum processing tools.

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