Description
Technical Specifications
- Product Model: 001‑4130‑03
- Brand: Brooks Automation
- Warranty: One Year
- Input Voltage: 24 V DC / 120 V AC dual‑range power supply
- Operating Temperature: 10 °C to +40 °C
- Storage Temperature: ‑20 °C to +60 °C
- Response Time: ≤20 ms alignment control loop cycle
- Protection Class: IP20 (rack‑mount module, clean‑room cabinet installation)
- Accuracy Class: Sub‑micrometer positioning control grade
- Output Frequency: Not applicable, motion‑control signal processing
- Rated Current Range: 0‑1.8 A maximum module consumption
- Communication Interface: RS‑232, RS‑485, Ethernet
- Supported Protocols: Custom Brooks automation protocol, TCP/IP serial communication
- Overload Capacity: Internal electronic over‑current and over‑voltage protection
- Dimensions: 245 mm × 195 mm × 70 mm
Product Overview
The Brooks 001‑4130‑03 is a dedicated VCE‑series wafer pre‑aligner controller module built for 300 mm semiconductor wafer handling systems. This rack‑mount electronic module executes closed‑loop motion‑control logic for wafer pre‑alignment mechanisms, processes optical sensor feedback data, and delivers precise orientation commands to positioning actuators before wafer transfer to process chambers. It addresses common semiconductor‑manufacturing pain points including inconsistent wafer notch‑alignment accuracy, sensor‑signal noise in clean‑room environments, and poor interoperability between handling robots and pre‑aligner assemblies. Semiconductor equipment technicians, fab‑automation engineers and equipment‑maintenance teams gain operational value from this unit. Its high‑speed signal processing maintains repeatable sub‑micrometer alignment performance, reduces wafer‑misplacement‑related yield loss, and supports diagnostic logging for equipment‑health tracking. Designed for original‑tool integration and spare‑part replacement, it fits existing Brooks wafer‑handling platforms without major mechanical rework.
Application Scenarios
- 300 mm Wafer Pre‑Alignment for Lithography Tools: Drives pre‑aligner motion sequences inside semiconductor front‑end equipment. It reads optical notch‑edge sensor data, computes angular offset and rotates wafers into correct angular orientation prior to hand‑off to process‑tool robotic arms. Consistent alignment quality prevents exposure errors during photolithography processing.
- Semiconductor Etch & Deposition Tool Material Handling: Deployed within wafer‑handling subsystems of etch and thin‑film‑deposition process tools. It ensures uniform wafer positioning before loading into vacuum chambers, minimising particle‑generation risk and improving process‑result repeatability across production lots.
- Fab‑Equipment Retrofit & Spare‑Part Replacement: Acts as direct replacement controller for ageing Brooks VCE‑series pre‑aligner hardware. Matching electrical interfaces and communication protocol remove the requirement for host‑system software re‑engineering and shorten fab‑tool downtime during component swap‑out.
- Automated Material Handling System Integration: Interfaces with fab host controllers and wafer‑transfer robots via Ethernet and serial links. It transmits alignment status, fault codes and process‑event logs to upper‑level equipment‑control software for centralised production monitoring.
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