Description
LAM 810-370141-001 Circuit Board Sensor Module
810-370141-001
The LAM 810-370141-001 is a highly versatile module, finding its niche in industries such as semiconductor manufacturing, where precision and stability are of utmost importance. In semiconductor fabrication plants, it serves as a key element in the control and monitoring of critical processes. For example, it can be integrated into the dry etching systems, which are essential for creating intricate patterns on semiconductor wafers. By precisely regulating various parameters, it ensures that the etching process occurs with utmost accuracy, contributing to the production of high – quality semiconductor devices. In the realm of photoelectronic device manufacturing, the module helps in maintaining optimal conditions for the production of components like LEDs and solar cells. It can monitor and adjust factors such as temperature and voltage during the manufacturing process, enhancing the efficiency and performance of these devices.
| Label |
Specification |
| Model Number |
810 – 370141 – 001 |
| Brand |
LAM Technologies |
| Type |
Modular Control and Monitoring Module |
| Input Voltage |
5V |
| Output Voltage |
3.3V |
| Operating Temp |
-40°C to +85°C |
| Communication Interfaces |
SPI, RS – 232 |
| Mounting |
SMD (Surface – Mounted Device) for compact integration |
| Dimensions |
Compact size optimized for space – constrained applications |
| Compatibility |
Seamlessly integrates with other LAM products and select third – party systems |
| Warranty |
One – year manufacturer’s warranty for peace of mind |
810-370141-001
The LAM 810-370141-001 boasts a modular design, which is one of its most significant strengths. This modularity allows for easy customization and integration into existing industrial systems. Different modules can be combined or replaced as per the specific requirements of the application, providing flexibility and scalability. For instance, if a semiconductor manufacturing process needs to be upgraded or modified, the modular design of this module enables quick adaptation without having to overhaul the entire system.
In terms of communication, it supports multiple protocols, including SPI and RS – 232. This wide range of communication capabilities makes it highly interoperable. It can communicate with various sensors, actuators, and control units within an industrial network. For example, in a large – scale industrial automation setup, it can exchange data with temperature sensors, pressure sensors, and motor controllers, facilitating efficient coordination of different processes. The module’s ability to work across different communication interfaces also means that it can be used in both legacy systems and modern, state – of – the – art industrial setups.
810-370141-001
The SMD packaging of the LAM 810-370141-001 offers several advantages. It not only reduces the overall size of the module but also improves its electrical performance. The compact form factor makes it suitable for applications where space is at a premium, such as in miniaturized industrial control systems or in devices where every millimeter of space counts. Additionally, the SMD packaging enhances the module’s resistance to environmental factors like vibration and dust, ensuring reliable operation in harsh industrial environments.
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