Description
LAM 810-073479-215 control board PCB board
810-073479-215
The LAM 810-073479-215 functions as a specialized control module within plasma etch or deposition tools, regulating critical process parameters such as gas flow, pressure, or RF power distribution. Unlike generic industrial components, it is tailored to the extreme conditions of semiconductor manufacturing—high vacuum environments, corrosive process gases, and sub-nanometer precision requirements. Its role is foundational: translating system commands into precise actuation, ensuring that each wafer undergoes consistent processing across thousands of production cycles. The LAM 810-073479-215 integrates seamlessly with LAM’s Centura® and Altus® platforms, making it a vital link in the chain that produces advanced microchips powering everything from smartphones to automotive electronics.
For more information, please click on the following link:
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Label
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Specification
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Model Number
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810-073479-215
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Brand
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LAM Research
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Type
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Precision Process Control Module (Semiconductor Equipment)
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Operating Voltage
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24V DC (nominal), 18-30V DC range
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Process Compatibility
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Plasma etch, CVD/PVD deposition (300mm wafers)
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Environmental Rating
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Designed for high vacuum (10⁻⁶ Torr) and cleanroom Class 1 standards
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Communication Protocol
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Proprietary LAM system bus (compatible with tool control software)
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Operating Temp
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15-35°C (59-95°F)
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Certifications
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SEMI S2, ISO 14644-1 (cleanroom compliance), CE
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Dimensions
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120mm (H) x 85mm (W) x 150mm (D)
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Weight
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Approximately 450g (15.9oz)
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Material Compatibility
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Resistant to corrosive gases (NF₃, Cl₂, CF₄)
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MTBF (Mean Time Between Failures)
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>10,000 hours (under typical operating conditions)
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Reliability is another hallmark: it features redundant sensing circuits that detect anomalies (e.g., voltage spikes, pressure fluctuations) and trigger fail-safes to protect both the module and the wafer. This redundancy is vital in fabs where unplanned downtime can cost thousands of dollars per minute. Additionally, the LAM 810-073479-215 is designed for hot-swap capability, allowing technicians to replace it without powering down the entire tool—reducing maintenance-related downtime by up to 70% compared to non-swappable components.
- 810-073479-214– A lower-power variant optimized for 200mm wafer tools, with reduced gas flow capacity.
- 810-073479-216– Enhanced version with extended temperature range (-5 to 45°C) for extreme environment tools.
- 810-073480-102– Compatible gas flow sensor module, often paired with 810-073479-215 for closed-loop control.
- 810-073478-301– RF matching network component that works in tandem with the 810-073479-215 to stabilize plasma.
- 810-073479-220– Variant with Ethernet/IP communication for integration into smart fab networks.
- 810-073479-217– High-purity version with electropolished surfaces, ideal for EUV lithography
For more information, please click on the following link:
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