Description
Lam Research 853‑049542‑173 24‑Channel Temp Control Daughter PCB
Technical Specifications
- Product Model: 853‑049542‑173
- Brand: Lam Research
- Warranty: One Year
- Module Type: 24‑channel temperature control daughter PCB assembly
- Channel Count: 24‑channel signal conditioning for thermal sensor inputs
- Function: RTD / thermistor signal conditioning, analog front‑end for chamber temperature monitoring
- Interface: Matches to 853‑203016‑173 main temperature‑controller motherboard
- Operating Temperature: 0 °C ~ +55 °C
- Storage Temperature: ‑40 °C ~ +85 °C
- Protection Class: IP20 plug‑in daughter‑card PCB
- Accuracy Class: Semiconductor fab precision thermal‑signal‑conditioning grade
- System Compatibility: Lam 300 mm etch tool thermal‑control subsystem
- Diagnostics: Analog test points for per‑channel signal validation
- Humidity: 5‑95 % RH non‑condensing, clean‑room compliant
- Weight: 0.37 kg
- Dimensions: Daughter‑card form factor mating with main temp‑control motherboard

Product Overview
853‑049542‑173 serves as signal‑conditioning daughter board working together with 853‑203016‑173 main temperature‑controller board. It conditions low‑level RTD and thermistor sensor signals from process chamber heater pedestals before passing to main control logic. Critical spare for maintaining multi‑loop wafer‑temperature stability during high‑volume production runs. Surplus and refurbished tested spare daughter PCB for Lam tool PM and repair activities.
Application Notes
‑ Observe strict ESD precautions during handling and insertion. ‑ Confirm proper mating connector seating with main motherboard. ‑ Typical deployment: Lam 24‑channel temp‑control daughter‑PCB spare‑part stocking.






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