Description
0200-36118 – AMAT Semiconductor Ceramic Insulator Ring
Product Overview
The 0200-36118 is an original high-purity ceramic insulator ring manufactured by Applied Materials (AMAT), specially designed for semiconductor wafer processing equipment. As a critical consumable and insulating component for etching and deposition process chambers, this ceramic ring features ultra-high insulation performance, excellent plasma resistance, and low particle generation. The 0200-36118 effectively isolates electrical components inside the process chamber, prevents current leakage and arc discharge, and maintains stable plasma environment. It strictly controls particle contamination and process parameter deviation, ensuring high yield and stable wafer processing in advanced semiconductor manufacturing processes.
Technical Specifications
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Brand: AMAT (Applied Materials)
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Model: 0200-36118
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Warranty: One Year
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Condition: 100% New & Original
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Product Type: Semiconductor Process Chamber Ceramic Insulator Ring
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Core Material: High-purity industrial alumina ceramic, high density and low porosity
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Insulation Performance: Ultra-high dielectric strength, zero leakage under high-voltage plasma environment
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Process Adaptation: Compatible with semiconductor etching and PVD/CVD deposition process chambers
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Anti-Corrosion Performance: Resistant to high-energy plasma erosion and corrosive process gas
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Particle Control: Ultra-smooth precision polished surface, effectively reducing micro-particle pollution
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Thermal Stability: Excellent high-temperature resistance and low thermal expansion coefficient
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Operating Temp: -20℃ to +600℃ long-term stable process temperature range
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Processing Precision: Strict dimensional tolerance, perfect chamber fitting and sealing
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Cleanliness Grade: Semiconductor ultra-clean grade, compliant with wafer fabrication standards
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Service Feature: Long service life, low replacement frequency, stable process repeatability
Application Scenarios
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Semiconductor Wafer Etching Process: The 0200-36118 is a core insulating component for AMAT etching equipment process chambers. It isolates high-voltage radio-frequency components, stabilizes plasma discharge uniformity, avoids abnormal arcing and process breakdown, and ensures consistent etching precision and wafer surface quality during mass production.
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Thin Film Deposition Process: Widely deployed in PVD and CVD thin film deposition systems. Its high-purity ceramic material avoids metal ion precipitation and particle pollution, maintaining high cleanliness inside the chamber and guaranteeing uniform thickness and structural stability of wafer thin film layers.
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Advanced Chip Fabrication Production: Suitable for 8-inch and 12-inch wafer fabrication lines, compatible with mid-to-advanced semiconductor process nodes. It adapts long-term continuous high-intensity process operation, reduces equipment downtime caused by component aging, and improves the overall yield and production efficiency of chip manufacturing.
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