Technical Specifications

• Product Model: 3156115‑704 (Apex‑5513)
• Brand: Advanced Energy (AE)
• Warranty: One Year
• Input Voltage: 208‑240 V AC, 3‑phase industrial mains supply
• Operating Temperature: +5 °C ~ +40 °C; forced‑air cooling required
• Storage Temperature: ‑20 °C ~ +70 °C
• Response Time: RF power closed‑loop adjustment <1 ms
• Protection Class: IP20, 19‑inch rack‑mount chassis
• Accuracy Class: Output power regulation accuracy ±0.5 %FS
• Output Frequency: 13.56 MHz RF standard industrial frequency
• Rated Current Range: Max RF output power 5500 W; reflected‑power monitoring circuit
• Communication Interface: Analog I/O, RS‑232, DeviceNet serial interface; front‑panel status LED & display
• Supported Protocols: DeviceNet, custom AE serial protocol, analog 0‑10 V / 4‑20 mA control interface
• Overload Capacity: Built‑in reflected‑power protection, over‑temperature, over‑voltage, interlock‑chain protection; arc‑fault detection
• Dimensions: 483 mm × 445 mm × 178 mm (19‑inch 4U rack unit); weight approx.24.5 kg
• 

Application Scenarios

• Semiconductor Wafer Plasma‑Etch Process: Provides high‑stability 13.56 MHz RF power for wafer‑etch chambers; fast closed‑loop power regulation adapts to dynamic plasma impedance shift during wafer‑processing.
• PVD / CVD Vacuum Thin‑Film Deposition Systems: Used for flat‑panel display, solar‑cell and optical‑coating production‑lines; drives plasma‑sputtering chambers for high‑uniformity thin‑film‑deposition.
• Industrial Plasma Surface‑Treatment Equipment: Deployed for material surface‑activation, cleaning and plasma‑polymerization process in vacuum‑coating machines.
• Research‑Laboratory High‑Power Plasma‑Test‑Benches: Supports academic‑lab vacuum‑plasma‑experiment set‑ups; multi‑mode control and comprehensive diagnostic functions facilitate process‑parameter development.
• Legacy Fab‑Equipment Retrofit & Spare‑Part Replacement: Direct‑form‑fit spare unit for existing Apex‑5513 RF‑generator hardware. Electrical‑interface, communication‑protocol and mechanical‑rack‑dimension compatibility minimizes tool‑reconfiguration work and shortens fab‑equipment‑downtime during unit swap‑out.