Description

LAM Research 810-800256-005 Node Board PCB Module

Technical Specifications

• Product Model: 810-800256-005
• Brand: LAM Research
• Warranty: One Year
• Input Voltage: 24 VDC ±10%
• Operating Temperature: -20°C to +60°C
• Storage Temperature: -40°C to +85°C
• Response Time: ≤10ms for internal signal processing
• Protection Class: IP20 (for cabinet-mounted installation)
• Accuracy Class: Industrial grade digital signal precision, ±0.05% signal deviation
• Output Frequency: Up to 1kHz internal bus clock frequency
• Rated Current Range: Continuous 4A, peak 8A short-duration load
• Communication Interface: On-board parallel bus, terminal block hardwired I/O interface
• Supported Protocols: Custom internal equipment bus, digital DI/DO point-to-point transmission
• Overload Capacity: 200% short-term overload with automatic circuit cutoff protection
• Dimensions: 220mm (L) × 150mm (W) × 35mm (H)

Product Overview

The 810-800256-005 is a dedicated Type 3 PCB node control board engineered exclusively for LAM Research semiconductor processing equipment and high-precision wafer fabrication automation systems. This core circuit board serves as a distributed local control node that executes on-site logic processing, collects discrete equipment status signals, relays interlock trigger commands, and facilitates data exchange between field sensors and the main equipment host controller.

It resolves critical pain points in semiconductor production environments, including unstable local signal aggregation, delayed safety interlock response, and difficult modular fault isolation within complex deposition and etching tools. Built with industrial-grade PCB laminates, reinforced soldering joints, and EMC filtering components, the board resists electromagnetic interference, minor mechanical vibration, and temperature fluctuations common inside vacuum processing chambers and cleanroom equipment cabinets.